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  • UV Laser secans Machina

UV Laser secans Machina

Description:

Laser secans ultraviolanam machinam maxime adhibet ad praecisionem laser micromachining ut laser secans, exercens, scribens, caeca sculptura, etc. superficies curvae vel planae ut PCB tabulae, camerae, et modulorum recognitionis fingerprints.


  • Exigua latitudo incisura commissura;15 ~ 30um
  • Machinatio alta accurate:≤±15um
  • Bonitas incisionis;incisio lenis, zona parva caloris affectata, lappa minus et ore detracta
  • Magnitudo elegantia;ad minimum productum mole est 20um

    • Product Detail

    UV laser sectione machina
    Laser ultraviolacea secans machina maxime adhibita est ad PCB laser segmentatio et exercitatio, camera, digitus agnitionis moduli FPC secans, aperitio fenestrae cinematographicae cinematographicae mollis et durae tabulae, retegendo et torulo, schedam ferro siliconam, schedam ceramicam scribentem, materias compositas ultra tenues. et foil cupri, aluminii foil &, fibri carbonii, fibra vitrea, Pet, PI, aliaque laser secandas processus.Antennae communes ut cupri incisas et formantes, PCB tabulam secans et formans, FPC secans et formans, fibra vitrea secans et formans, pellicula secans et formans, aurum patella specillum formans, etc.

    Parametri technicae:

    Maxime operating celeritate 500mm/s（X）；500mm/s（Y1Y2）；50mm/s（Z）；
    Positioning accuracy ±3um（X）±3um（Y1Y2）；±3um（Z）；
    1Repetitive positioning accurac ±1um（X）；±1um（Y1Y2）；±1um（Z）；
    1Machining materia FPC & PCB & PET & PI & cupri foil & aluminii foil & carbonis fibra & vitrea & composita materia & ceramic & alia materia
    Materia muri crassitudine 0~1.0±0.02mm；
    Machining range planum 400mm* 350mm；
    Genus laser UV fibra laser;
    1Laser adsum 355±5nm；
    1Laser potentia Nanosecond & picosecond，10W & 15W pro option
    1Laser frequency 10~ 300KHz
    1Power stabilitatis <± 3% (operatio continua per 12 horas);
    1Power copia 220V±10%,50Hz/60Hz；AC 20A.
    1File forma DXF、DWG&Gebar；
    Dimensiones 1200mm*1400mm* 1800mm ；
    apparatu pondus 1500Kg；

    Sample Exhibition:

    image10

    application scope
    PCB laseris scindendi & exercendi;Camera & identificatio fingerprints moduli fpc secando;Pelliculam tegens veli fenestra, & discooperiens, & pampinatio dura & molli compage lamina;Silicon steel sheet & Ceramic Scribing;Ultra tenuem materiam compositam & aes foil & aluminium foil & carbonis fibra & fibra vitrea & Pet & PI laser machining secans.

    Magna cura machining
    Parva secans summa latitudine: 15 ~ 35um
    Maximum machining accurate ≤ 10um
    Bonitas incisionis: lenis incisio & parva calor affectata zona & minus lappa
    Size elegantia: minimum productum magnitudine 50um

    Fortis accommodatio
    օ Habere facultatem laseris incidendi, exercendi, scribendi, caecae insculpendi et alia technologiae technologiae tenuis ad plani & regularis superficiei curvae instrumentorum.
    Potest machina FP & PCB & PET & PI & cupri ffoyle & aluminium foil & carbonii fibra & vitrea & composita materia & ceramic & alia materia
    Provide auto-exculta directam coegi XY superpositionem generis & split type gantry certae motus suggestum & automatic onerationis et unloading systema optionis
    Praebere munus pre scan bilateralis CCD visionis locationis & scopo capiendi et locationis
    Instructus cum subtilitate vacuum adsorptionis fixture & pulvis remotionis ratio pipeline
    instructus auto-exculta 2D & 2.5D CAM systema software pro laser micromachining

    Flexibile design
    notionem ergonomicum sequere consilium, exquisita et concisa est
    օ Coniunctio programmatum et ferramentorum est flexibile, munus personale sustinens configurationem et administrationem productionis intelligentis
    Support positivum & innovative design from component level to system level .
    օ Open type control, laser micro-machining software system, easy to operate & intuitive interface .

    Technical certificatione
    CE
    ISO9001
    IATF16949

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