PCB Substrate Subtilitas Fibra Laser Secans Machina
PCB substrata praecisio fibra laser machina secans maxime adhibetur pro laser microprocessing sicut laser secans, exercens et scribens variarum subiectarum PCB, quae referri possunt ad ut PCB laser apparatus secans pro brevibus.Ut PCB aluminium substratum secans et formans, aes substratum secans et formans, substratum ceramicum secans et formans, laser formans, assium substratum laser formans, spumam secans et formans, etc.
Parametri technicae:
Maxime operating celeritate | 1000mm/s(X) ;1000mm/s(Yl&Y2) 50mm/s(Z); |
Positioning accuracy | ±3um (X) ±3um (Y1&Y2) ±5um (Z); |
Repetita accurate positioning | ±lum (X) ±lum(Y1&Y2) ±3um(Z); |
Machining material | subtilitas immaculatam chalybem, durum mixturae ferro et aliis materiis ante vel post superficiem curationis |
Materia muri crassitudine | 0~2.0±0.02mm; |
Machining range planum | 600mm * 800mm (pro majoris forma requisitis auxilium customization) |
Genus laser | Fibre laser; |
laser adsum | 1030-1070±10nm; |
laser potentia | CW1000W&CW2000W&QCW150W&QCW450W&QCW750W pro optione; |
Apparatu virtutis copia | 220V± 10%, 50Hz;AC 30A (circuitus principalis ruptor); |
Tabellae forma | DXF、DWG; |
Apparatus dimensiones | 1750mm*1850mm*1600mm; |
apparatu pondus | 1800Kg; |
Sample Exhibition:
application scope
Laser micromachining plani et superficiei curvae instrumentorum praecisionis ferro intemeratae et mixturae durae ante vel post curationis superficiei
Magna cura machining
Parva secans summa latitudine: 20 ~ 40um
Maximum machining accurationis: ≤± 10um
Bonitas incisionis: lenis incisio & parva calor affectata zona & minus lappa
Size elegantia: minimum productum magnitudo est 100um
Fortis accommodatio
օ Facultatem laseris secandi, exercendi, notandi et alia subtilia machinae PCB subiectae
Potest machinae PCB aluminii subiectae, aeneae, subiectae ceramicae aliaeque materiae
օ instructus auto-evoluta directo-coegi mobile dual-coegi subtilitatem motus suggestum, suggestum lapidis suggestum & consignatum fusa configuratione
Dual positioning & visual positioning & automatic loading and unloading system & other functions optional
Instructus cum auto-exculta longitudinis & brevis arx longitudinis acutae COLLUM & planae COLLUM laser secans caput
instructus auto-exculta 2D & 2.5D & CAM systema software pro laser micromachining
Flexibile design
Consilium conceptum sequere ergonomicum, delicatum et brevem
օ Software flexibile & hardware functionis collocationis, sustinens personalem functionem configurationem & administrationem productionis intelligentis
Support positivum innovation design a component level to system level
օ Aperi imperium & laser micromachining systema software facile ad operandum & intuitive interface
Technical certificatione
CE
ISO9001
IATF16949