Subtilitas 3c solutio

ECLC6045 Subtilitas Laser Secans Machina pro Hard fragili materialibus

Description:

Laser micromachining ceramicorum, sapphiri, adamantis et calcii chalybi, duritiei altae & altitudinis plani fragilitatis et instrumentorum curvarum regularium


Product Detail

Technical Parameters

Maxime operating celeritate 1000mm/s(X) ;1000mm/s(Yl&Y2) 50mm/s(Z);
Positioning accuracy ±3um (X) ±3um (Y1&Y2) ±5um (Z);
Repetita accurate positioning ±lum (X) ±lum(Y1&Y2) ±3um(Z);
Machining material Alumina & zirconia & aluminium nitride & silicon nitride & Diamond &
Sapphire & Silicon & gallium arsenide & ferro tungsten, &c;
Materia muri crassitudine 0~2.0±0.02mm;
Machining range planum 300mm * 300mm (pro majoris forma requisitis auxilium customization)
Genus laser Fibre laser;
laser adsum 1030-1070±10nm;
laser potestatem CW1000W&QCW150W& QCW300W& QCW450W pro optione
Apparatu virtutis copia 220V± 10%, 50Hz;AC 20A (circuitus principalis ruptor);
Tabellae forma DXF、DWG;
Apparatus dimensiones 1280mm*1320mm*160mm;
apparatu pondus 1500Kg;

Sample Exhibition

ECLC6045-2application scope

օ Laser micromachining ceramicorum, sapphiri, adamantis et calcii chalybis, duritiei & altitudinis plani duritiei & instrumentorum curvarum regularium.

Magna cura machining

Parvus secans summa latitudine: 15 ~ 30um

Maximum machining accurationis: ≤± 10um

օ Bonitas incisionis: lenis incisio, zona parva calor affectata, lappa minus et ora detracta 15um

Size elegantia: minimum productum magnitudo est 100um

Fortis accommodatio

1. Habere facultatem laseris secandi, exercendi, slotting, notandi, et alia subtilia processus artes pro instrumentis superficiei plani & curvae

2. Can machina alumina, zirconia, aluminium nitridum, nitridum pii, adamas, sapphirus, pii, gallium arsenidum et chalybem tungsten.

3.Equipped cum auto-evoluta directum coegi mobile duplex exactio motus coegi suggestum, suggestum lapidis, aluminium stannum lapidis ad delectu

4. Provide munus libitum, ut duplex stationis visual & Positioning & automatic pastus ac exoneratio systematis & dynamica vigilantia etc.

5.Equipped cum auto-evoluta longitudinis & brevis arx longitudinis acuta COLLUM & plana COLLUM denique laser secans caput

6.Equipped cum materia modulari accipiendi et pulveris remotionem systematis pipeline

7.Provide tensionis mobilis sui evolutae & fixae tensionis frame & vacui adsorptionis & mellis laminae, etc.

8.Equipped cum auto-evoluta 2D & 2.5D & 3D CAM systema software pro laser micromachining

Flexibile design

1. Sequitur consilium conceptus ergonomics, subtilis et concisus

2.Flexible software & hardware function collocationis, sustinens personalem functionem configurationem & productionem intelligentem procuratio

3.Support positivum innovation consilium ex componentibus gradu ad systema level

4.Open control & laser micromachining systema software facile ad operandum & intuitive interface

Technical certificatione

CE

ISO9001

IATF16949


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